Simoloyer® CM01

Application
high kinetic milling device:

  • High Energy Milling (e.g. ductile metal flakes)
  • Mechanical Alloying (e.g. ODS-alloys)
  • Reactive Milling (e.g. contact material)
  • fine grinding, mixing, dispersing, homogenizing
  •  wet & dry operation, controlled atmosphere
    nano-structured, nanocrystalline & amorphous materials
    composite-materials (MMC, CMC, MMC, CCC)

thumbnail of CM001 (E) 2301